Hgtech Wafer Cutting Series Semiconductor Wafer Processing Plant Laser Modified Cutting Equipment

• Customization: Available
• Application: Power Electronic Components, Semiconductor Wafer
• Batch Number: 2023+
• Model NO.: Semiconductor Wafer
• Certification: CCC, EPA
• Manufacturing Technology: Optoelectronic Semiconductor
• Material: Power Semiconductor
• Model: PC817
• Package: Semiconductor Wafer
• Signal Processing: Digital
• Type: Intrinsic Semiconductor
• Transport Package: Packing
• Specification: Custom
• Trademark: HGTECH
• Origin: China
• Production Capacity: 500PCS

Product Description

Product Description

HGTECH Wafer Cutting Series Semiconductor Wafer Processing Plant Laser Modified Cutting Equipment Mainly used for metal and silicon, germanium, gallium arsenide, and other semiconductor material substrate scribing and cutting, machinable solar panels, silicon, ceramic, aluminum foil, etc., the workpiece is fine and beautiful with smooth cutting edges.

Product advantages:

• High quality

          There is no damage on the surface, no cutting seam, and the edge collapse is very small (≤ 2 μ m) , the edge is small (< 3 μ m)

• High efficiency

          Multi focus modification mode can be adopted to multiply the cutting efficiency

• Good stability

          The laser has high average power stability (≤± 3% over 24 hours) and high beam quality (M ² < 1.5)


 

Item		Main parametetrs
Laser	Center wavelength	Custom infrared wavelength
	Cutting head	Self-developed collimating head
Performance	Effective working stroke	300x400mm(optional)
	Repetitive positioning accuracy	±1μm
	Visual positioning	Automatic visual positioning
	Processing method	Layer by layer upgrading, single point / multi-point processing
Others	Wafer size	8 inch (12inch is compatible )
	Processing process	Laser modified cutting - film spreading
	Processing object	MEMS chip, silicon-based biochip, silicon wheat chip, CMOS chip, etc

Samples:

Company Profile

About Us

 

 

 

FAQ

Q: What's the package?

A: We have 3 layers package. For the outside, we adopt wood craft case. In the middle, the machine is covered by foam, to protect the machine from shaking. For the inside layer, the machine is covered by thickening plastic bag for waterproof.

 

Q: Will the package damaged during transportation?

A: Our package is considerate all the damage factors and make it to be safe, and our shipping agent have full experienced in safe transportation. We have exported to 180 countries worldwide. So please don't worry, you will receive the parcel in good condition.

 

Q: How to install and run the machine?

A: Our technician have installed the machine before shipping. For some small parts installation, we will send detail training video, user's manual along with the machine. 95% customers can learn by themselves.

 

Q: How can I do if the machine goes wrong?

A: If confronted with such problems, please contact us asap and do not try fix the machine by yourself or someone else. We will response within 24 hours as quick as we can to solve it for you.

Please advise us the following information, then we can recommend you the most suitable model, right now, don't hesitate to contact -China HG Laser!